Free участник - Goldlink Tongda Electronics Co., Ltd
Данные компании Описание компании
  Free участник
  Продавец / Производитель
Зарегистрирован 2016-05-11 20:23:12
Последний логин 2016-10-31 19:18:18
Последняя активность 2021-04-18 23:40:02
Контакт Lynn, Gui
Страна Китай
Адрес Shenzhen, Block 45, Bao'an, Shenzhen
Тел./Факс 86-755-27579310
WEB-сайт www.glpoly.com
Goldlink Tongda Electronics Co., Ltd is committed to the design, development and manufacture of Thermal Interface Materials, developing high quality TIMs and Thermal Solution is our first priority. Our outstanding R&D team are able to deliver the effective thermal solutions to customers for facing current advanced products. Products Our business includes Thermal Silicone Pad, Thermal Silicone Gel, Thermally Conductive Epoxy Adhesive, Thermal Gap Filler, Non-silicone Thermal Interface Materials, Thermally Conductive Insulator, Hybrid Thermal/EMI Absorber Materials and more. Applications We serve a multitude of industries worldwide including New energy vehicles, UAV(Drone), computer, telecommunications, consumer electronics, optical products, LED lighting, air flight, storage device, military and medical equipment, power conversion.
Продукты компании
Low Density Thermal Pad and Bergquist VO Soft Thermal Gap Pad
Другие Электронные Аксессуары
03 USD
Low density thermal pad for electrical vehicle
GLPOLY Thermal Gel vs Chomerics THERM-A-GAP GEL 60
Другие Электронные Аксессуары
03 USD
designed to replace conventional thermal conductive gap filler or pad. Simply dispense thermal gel onto component, assemble heat sink over it, and the product is ready to go. It is ideal for rework and maintainment situation.
Thermal Gap Pad Substitutes For Berquist Gap Pad A2000
Другие Электронные Аксессуары
02 USD
GLPOLY thermal pad is featuring a high thermal conductivity of 6.0W/mK, it’s higher than that of most of competitor. Comparing with BQ 5000S35, the data will shows that GLPOLY thermal gap filler pad can perfectly replace the BQ 5000S35.
Non-silicone Thermal Pad Designed For Silicone-sensitive Devices
Другие Электронные Аксессуары
03 USD
The non-silicone thermal pads are resilient and with large deformation, suitable for silicone sensitive applications, no siloxane volatiles, no oil bleeding. Apply to consumer electronics and precision devices eliminating silicone concerns.
Phase Change Materials Provides Excellent Thermal Performance
Другие Электронные Аксессуары
02 USD
Thermal Pad for vihicle
Thermally Conductive Insulator Provides Excellent Electrical And Thermal Properties
Другие Электронные Аксессуары
03 USD
Fiberglass coated with thermal compound, providing excellent electrical and thermal properties. Designed for a variety of applications requiring high thermal performance and electrical isolation.
Thermally Conductive Tape
Другие Электронные Аксессуары
01 USD
Introduction Thermal conductive, electrical insulation and double sided adhesive films. With excellent temp resistance, high thermal conductance and good insulation properties. The viscosity strength will become stronger gradually.
Hybrid Thermal and EMI Absorber Materials For Telecom Devices
Другие Электронные Аксессуары
03 USD
Combining thermally conductive and EMI absorption, helps solve two problem in a limited space. gel-like modulus improves thermal contact, making heat transfer more effective.
Thermal Gap Filler Designed For EV Battery Thermal Management
Другие Электронные Аксессуары
02 USD
Two part ceramic-filled silicone gels with high thermal conductivity. After mixing, reaction will take place at room temperature or speed up the reaction by heating. No by-product in cure process. It is ideal for filling intricate gaps.
Non-silicone Thermal Gel For Automotive Electronics Cooling
Другие Электронные Аксессуары
03 USD
This material is non-silicone based, high performance thermally conductive gap filling gel. It features non-dry out, non-pump out. It provides proven reliability under extreme temperature cycling. Low thermal resistance, low stress on components.
Copyright notice © 2000-2024 © www.bazar-az.com