Free Member - Goldlink Tongda Electronics Co., Ltd
Company Info Company Description
  Free Member
  Seller / Manufacturer
Registered 2016-05-11 20:23:12
Last Login 2016-10-31 19:18:18
Last Action 2020-11-18 17:57:56
Contact Lynn, Gui
Country China
Address Shenzhen, Block 45, Bao'an, Shenzhen
Phone/Fax 86-755-27579310
Website www.glpoly.com
Goldlink Tongda Electronics Co., Ltd is committed to the design, development and manufacture of Thermal Interface Materials, developing high quality TIMs and Thermal Solution is our first priority. Our outstanding R&D team are able to deliver the effective thermal solutions to customers for facing current advanced products. Products Our business includes Thermal Silicone Pad, Thermal Silicone Gel, Thermally Conductive Epoxy Adhesive, Thermal Gap Filler, Non-silicone Thermal Interface Materials, Thermally Conductive Insulator, Hybrid Thermal/EMI Absorber Materials and more. Applications We serve a multitude of industries worldwide including New energy vehicles, UAV(Drone), computer, telecommunications, consumer electronics, optical products, LED lighting, air flight, storage device, military and medical equipment, power conversion.
Company Products
Low Density Thermal Pad and Bergquist VO Soft Thermal Gap Pad
Other Electronic Accessories
03 USD
GLPOLY silicone thermal pad XK-P45 is a high performance thermal interface material for industrial computer thermal solution. it is practiced and verified by some top rank customers. NORCO is one of the most advanced industrial computer designer.
GLPOLY Thermal Gel vs Chomerics THERM-A-GAP GEL 60
Other Electronic Accessories
03 USD
GLPOLY The thermal gel XK-G60 is a high performance thermal management solution for electronics assembly, it is thermally conductive particle filled silicone gel with high conformability and thermally conductive properties.Chomerics THERM-A-GEL 60
Thermal Gap Pad Substitutes For Berquist Gap Pad A2000
Other Electronic Accessories
02 USD
GLPOLY thermal pad is featuring a high thermal conductivity of 6.0W/mK, itโ€™s higher than that of most of competitor. Comparing with BQ 5000S35, the data will shows that GLPOLY thermal gap filler pad can perfectly replace the BQ 5000S35.
Non-silicone Thermal Pad Designed For Silicone-sensitive Devices
Other Electronic Accessories
03 USD
The non-silicone thermal pads are resilient and with large deformation, suitable for silicone sensitive applications, no siloxane volatiles, no oil bleeding. Apply to consumer electronics and precision devices eliminating silicone concerns.
Phase Change Materials Provides Excellent Thermal Performance
Other Electronic Accessories
02 USD
PCMs were produced on the basis of phase-changing properties. Above phase change temperature, materials will soften, filling irregularities between the power module and heat sink and thereby improves the contact between the interfaces and heat transfer.
Thermally Conductive Insulator Provides Excellent Electrical And Thermal Properties
Other Electronic Accessories
03 USD
Fiberglass coated with thermal compound, providing excellent electrical and thermal properties. Designed for a variety of applications requiring high thermal performance and electrical isolation.
Thermally Conductive Tape
Other Electronic Accessories
01 USD
Introduction Thermal conductive, electrical insulation and double sided adhesive films. With excellent temp resistance, high thermal conductance and good insulation properties. The viscosity strength will become stronger gradually.
Hybrid Thermal and EMI Absorber Materials For Telecom Devices
Other Electronic Accessories
03 USD
Combining thermally conductive and EMI absorption, helps solve two problem in a limited space. gel-like modulus improves thermal contact, making heat transfer more effective.
Thermal Gap Filler Designed For EV Battery Thermal Management
Other Electronic Accessories
02 USD
Two part ceramic-filled silicone gels with high thermal conductivity. After mixing, reaction will take place at room temperature or speed up the reaction by heating. No by-product in cure process. It is ideal for filling intricate gaps.
Non-silicone Thermal Gel For Automotive Electronics Cooling
Other Electronic Accessories
03 USD
This material is non-silicone based, high performance thermally conductive gap filling gel. It features non-dry out, non-pump out. It provides proven reliability under extreme temperature cycling. Low thermal resistance, low stress on components.
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